Grinding Objects Sapphire wafers, silicon wafers, gallium arsenide, gallium nitride wafers. This abrasive wheel is primarily used for thinning and finishing semiconductor wafers
diamond
price_IDR210.000
HC Diamond 2
diamond
price_IDR210.000
Product Description
Grinding Objects Sapphire wafers, silicon wafers, gallium arsenide, gallium nitride wafers. This abrasive wheel is primarily used for thinning and finishing semiconductor wafers
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